Verified today
Principal Design Engineer
About the role
Cadence Design Systems' Analog Design team drives high‑speed interface IP development for Die‑to‑Die and chiplet systems. The Principal Design Engineer architects, designs, and validates analog/mixed‑signal circuits, collaborates with layout, verification, and advanced packaging groups, and leads silicon bring‑up and debug. Hyderabad, on‑site, hybrid schedule with occasional off‑site work as needed.
What you’ll do
- Architect and deliver high‑speed analog/mixed‑signal IPs for D2D and chiplet systems
- Define architecture, perform feasibility studies, and evaluate design trade‑offs for signal integrity and power
- Execute schematic design, simulation, and optimization using industry EDA tools
- Collaborate with layout, verification, and advanced packaging teams for co‑optimization
- Support layout reviews, parasitic extraction, and post‑layout sign‑off
- Lead silicon bring‑up, debug, and characterization activities
- Contribute to design methodology, checklists, and best practices
What you’ll bring
- 8+ years analog/mixed‑signal IC design
- Experience with high‑speed interfaces such as DDR, PCIe, SerDes, D2D links
- Strong knowledge of UCIe standard and chiplet architectures
- Proficiency in schematic design, simulation, and PVT corner analysis
- Understanding of advanced packaging impacts on high‑speed signaling
Skills
Education
Bachelor's or Master's degree in Electrical/Electronics Engineering