Senior Package Layout Engineer, Hardware

About the role

Hardware Package Layout Team at NVIDIA designs advanced ASIC package solutions. The Senior Package Layout Engineer creates high‑speed, high‑density substrate layouts, performs routing, placement, and power distribution using Cadence APD tools, and collaborates on feasibility studies and trade‑off decisions. Bengaluru, India, hybrid work model with on‑site collaboration as needed.

What you’ll do

• Collaborate with Technical Package Lead and design teams to implement high‑speed ASIC packages
• Develop substrate breakout patterns and optimize pinout assignments
• Perform package routing, placement, stack‑up, and power distribution using Cadence tools
• Propose layout trade‑offs and conduct feasibility studies for size, cost, and performance
• Create symbols and CAD library databases
• Develop methodologies to improve layout productivity

What you’ll bring

• B.S. Electrical Engineering or equivalent
• 5+ years PCB layout of graphics cards, motherboards, or line cards
• Experience with HDI designs
• Substrate layout of wire bond and flip chip packages
• Proficiency with Cadence APD or SiP tools
• Understanding of high‑speed signal integrity
• Familiarity with Virtuoso and Calibre
• Experience using Valor

Skills