Active listing
Package Layout Design Senior Staff Engineer
About the role
Advanced Packaging Organization at Marvell designs high‑speed IC packages that enable next‑generation connectivity and compute. The Senior Staff Engineer drives package development from concept through tapeout, creating C4 and BGA ball maps, defining die placement, padstacks, and net assignments, and authoring Package Requirement Documents. Bangalore, on-site, hybrid work model with occasional remote days, relocation assistance available.
What you’ll do
- Drive microelectronic package development from concept to tapeout
- Develop C4 and BGA ball maps optimized for SI/PI
- Plan and validate netlist mappings across dies and substrates
- Define die placement, padstacks, and package‑level connectivity
- Create and maintain Package Requirement Documents
- Contribute to tool, process, and flow development
- Collaborate with chip, board, and simulation teams
- Present designs and documentation to stakeholders
What you’ll bring
- 10+ years package layout experience
- Proficiency with Cadence OrbitIO/Integrity System Planner
- Experience with C4 and BGA ball map design
- Strong SI/PI fundamentals
- Knowledge of 2D/2.5D/CoWoS/EMIB packaging
- Scripting/automation skills
- Cross‑functional collaboration across global teams
- Excellent communication and documentation
Skills
Benefits
- Competitive compensation
- Comprehensive benefits
- Collaborative work environment
- Professional growth opportunities
- Relocation assistance