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Hiring companyCadence Design Systems

Verified yesterday

Principal Product Engineer – Digital & Signoff Group

Bangalore,India Full-time On-site

About the role

Cadence DSG (Digital & Signoff Group) builds next‑generation chip design software to solve complex physical design challenges at 7nm and below. The Principal Product Engineer acts as the bridge between R&D, Application Engineering, and global customers, driving product evolution, benchmarking, and flow innovation. Based in Bangalore, the role is on‑site with a focus on advanced node timing closure and PPA optimization.

What you’ll do

  • Serve as primary place‑and‑route resource for internal teams and external customers
  • Collaborate with R&D to diagnose and resolve software issues, ensuring robust tool releases
  • Execute competitive benchmarks to demonstrate Cadence’s edge in PPA
  • Develop and deploy customized RTL‑to‑GDSII methodologies and scripts
  • Partner with Product Marketing to align technical capabilities with market needs

What you’ll bring

  • Bachelor’s in Electronics Engineering or Master’s in Electronics Engineering
  • 6+ years industry experience (or 4+ years digital implementation experience)

Nice to have

  • Deep understanding of ASIC design flow (RTL‑to‑GDSII)
  • Experience with timing closure and PPA optimization at 7nm, 5nm or below
  • Proficiency in EDA tools for synthesis, placement, routing, and signoff
  • Scripting skills in Tcl, Python, or Perl
  • Strong verbal and written communication

Skills

ASIC designPhysical designTiming closurePPA optimizationEDA toolsTclPythonPerl