Verified yesterday
Principal Product Engineer – Digital & Signoff Group
About the role
Cadence DSG (Digital & Signoff Group) builds next‑generation chip design software to solve complex physical design challenges at 7nm and below. The Principal Product Engineer acts as the bridge between R&D, Application Engineering, and global customers, driving product evolution, benchmarking, and flow innovation. Based in Bangalore, the role is on‑site with a focus on advanced node timing closure and PPA optimization.
What you’ll do
- Serve as primary place‑and‑route resource for internal teams and external customers
- Collaborate with R&D to diagnose and resolve software issues, ensuring robust tool releases
- Execute competitive benchmarks to demonstrate Cadence’s edge in PPA
- Develop and deploy customized RTL‑to‑GDSII methodologies and scripts
- Partner with Product Marketing to align technical capabilities with market needs
What you’ll bring
- Bachelor’s in Electronics Engineering or Master’s in Electronics Engineering
- 6+ years industry experience (or 4+ years digital implementation experience)
Nice to have
- Deep understanding of ASIC design flow (RTL‑to‑GDSII)
- Experience with timing closure and PPA optimization at 7nm, 5nm or below
- Proficiency in EDA tools for synthesis, placement, routing, and signoff
- Scripting skills in Tcl, Python, or Perl
- Strong verbal and written communication