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Sr. Principal Product Engineer – Digital & Signoff Group
About the role
Cadence DSG (Digital & Signoff Group) builds next‑generation chip design software for 7nm and below. The Sr. Principal Product Engineer acts as the bridge between R&D, Application Engineering, and customers, driving place‑and‑route expertise, product evolution, and benchmark innovation. Based in Bangalore, the role is on‑site with a focus on physical design and timing closure.
What you’ll do
- Serve as primary place‑and‑route resource for internal teams and customers
- Collaborate with R&D to diagnose and resolve software issues
- Execute competitive benchmarks for PPA
- Develop and deploy customized RTL‑to‑GDSII methodologies
- Partner with Product Marketing to align technical capabilities with market needs
What you’ll bring
- 8+ years industry experience in ASIC design flow
- 7nm/5nm timing closure and PPA optimization
- Proficiency in Tcl, Python, or Perl
- Strong verbal and written communication
Nice to have
Bachelor’s in Electronics Engineering or Master’s with 6+ years digital implementation experience